Rebirth of Northern Technology - Chapter 641

Lin Weifang, staff canteen in Nanhu Park.

A group of graduate students from the Department of Physics visited the fab and met acquaintances during lunch.

“Sister, what does your team research?”

Zheng Shanyan has had a good personal relationship with Wei Xihan for a while.

“In my place, I mainly study three-dimensional chips.”

“Three-dimensional chip? Isn’t that the same thing that Brother Zhang studied?”

The Zhang Baihua team they just visited this morning, their main direction is the 3D chip.

Zhang Baihua is a rare one, just after graduating from Lin University, he led the army alone. The other teams are basically people from the Ice City University of Technology presiding over the overall situation.

Of course, Wei Xihan is even more rare.

Zhang Baihua is still a semiconductor major anyway, Wei Xihan is only a master’s background, and also majored in physics. But everyone knows that her situation is special, but no one can compare it.

“The research direction of Zhang Baihua’s team is more inclined to application. The research direction is memory.”

“do not understand.”

“Senior Brother Zhang, what do you say about their technology? Their 3D chips can only be regarded as 3D packages. They are multi-layer chips stacked on top of each other.”

Wei Xihan found that a few words were not clear at all, so he simply drew on the dinner table with his fingers.

“But why stack up the chips? There is no benefit to this at all?”

The other juniors at the same table joined the discussion.

Everyone had an eye-opening feeling during the visit to Lin Weifang.

Generally speaking, domestic technology generally lags behind the world’s advanced level by one or two eras. However, Lin Wafer is completely different, and many of its technologies and development directions are unheard of.

This visit made many people feel unreal.

When has China been so advanced in the chip industry?

“The biggest benefit of three-dimensional packaging is to reduce the energy loss during the internal data transmission. Because the vertical distance between the layers is much shorter than the plane layout…”

Wei Xihan, with great difficulty, even the gestures were drawn to illustrate the benefits of multi-layer packaging.

The inside of the chip is also divided into functional modules. There is a large amount of data interaction between each module. Therefore, the largest part of the data transfer volume in a chip is not external, but internal.

If the amount of data is too large and the data transmission path is too long, it will cause the chip to overheat, which in turn affects the chip’s performance and operating speed.

After the chips are stacked, the distance between the modules is greatly shortened, the energy consumption is lowered, the temperature is lowered, and the delay is lowered. In addition, the connection in the vertical direction also makes the wiring more choices and possibilities.

“Why haven’t you heard of such a good technology before?”

“It may be that foreign manufacturers find it troublesome. After all, this technology has a relatively high processing cost. If you do not consider the data bandwidth, from a functional point of view, the same function can be achieved with single-layer chip technology.”

Wei Xihan shrugged. After all, it is not her direct department.

—————————

In fact, the 3D packaging process appeared quite late, and did not enter the formal study until 2011.

This technology was developed because the development of lithography machines encountered bottlenecks.

To improve the integration of chips, in addition to improving the accuracy of the lithography machine, multi-layer patterning technology is commonly used. Among them, the LELE technology is the mainstream of Lin Wafer’s housekeeping secrets.

In addition to multi-layer pattern technology, there are several development directions, multi-layer packaging technology is one of them.

Increasing the integration of a chip is essentially a process of increasing the number of transistors per unit area.

With LELE technology, a layer is processed and etched in batches to achieve the effect of pattern densification.

Multi-layer packaging simply means stacking multi-layer chips together.

How easy it is.

(In the case of Liang Mengsong’s resignation in SMIC, the difference between Liang Mengsong and Jiang Shangyi is the dispute between LELE technology and the multilayer packaging route.)

After the multi-layer chip technology is mature, it has been popularized in the fields of memory, Flash memory and so on. Because of the patterns of these chips, the layers are consistent.

So the number of layers of memory chips began a process of continuous growth. The number of layers put into commercial use in later generations is as high as 256.

With the blessing of 3D packaging technology, the effective transistor density on the memory chip is already lower than 1 nanometer, or even lower than 0.1 nanometer!

Lin Wafer’s multilayer packaging technology, after nearly two years of exploration, is about to enter the practical stage.

The most difficult step in multi-layer packaging is interlayer punching technology.

Once this technology breaks through, there is nothing left.

With the blessing of 3D packaging technology, Lin Wafer’s memory products will soon be available.

Zhang Baihua’s team will be independent and set up a memory division, and will even be split in the future.

Although the Flash flash memory market has not yet become a climate, but only a RAM memory, its market size and capacity have reached hundreds of billions of dollars, close to or even surpass TFT LCD.

Lin Wafer cannot enjoy this market exclusively, but the value of a first move is at least tens of billions of dollars.

—————————

“Sister, Brother Zhang and their memory will be available soon. When will your true 3D chip be available?”

A group of people came in interest.

True 3D chips are definitely taller than fake 3D chips.

“Well, I don’t know. There are many difficulties now. I don’t think it will be practical for ten years.”

The things that Wei Xihan’s team researched are called FinFET and GAP by later generations. As for whether it was really the same thing, even Cheng Yongxing couldn’t confirm it.

The main difficulty in the introduction of 3D chips lies in processing costs and materials.

Although the semiconductor element of the three-dimensional structure has many advantages, such as lower current consumption, higher density, etc. But not all semiconductor devices can be made into three-dimensional structures.

On the same layer of circuits, some are three-dimensional structures, and some are two-dimensional, so when processing upwards, waste will occur in the high-level space.

Therefore, the benefits obtained by adopting a 3-dimensional chip structure are far lower than the processing costs paid. Later generations bite the bullet and broke through when 14 nanometers encountered obstacles.

“Just study it, no output?”

Everyone heard the words, and the disappointment was beyond words.

“This is the case for the time being, but it is not without gain. At least a lot of patent applications have been filed.”

Even in the face of former teammates, school girls, Wei Xihan still didn’t tell the truth.

Some research results have been quite practical.

But when the technology can be commercialized depends on the company’s strategic needs.

With the passage of time, the foundation of Lin Wafer, the LELE technology has slowly been exposed. 3D technology is a new killer and strategic weapon.

However, according to Wei Xihan’s estimation, this time will not come too late.

First of all, Lin Faye is not a militarized organization, and the non-disclosure agreement is signed for three to five years. No matter how much it is, it is simply unrealistic.

The LELE development team has already experienced staff turnover.

These team members, as long as they nod their heads, millions of annual salary, immigration, stocks, etc., will be delivered to the door.

It is simply unrealistic to expect private enterprises to seal up and keep business secrets for a long time.

At this point, even TSMC can’t do it.

In addition, Lin Weifang has been targeted.

With the gradual maturity of LELE technology, the news that Lin Wafer successfully achieved 0.2-micron-level samples on the 0.8-micron production line became explosive news.

In 1995, the world’s mainstream chip manufacturing technology was transitioning from 0.5 microns to 0.35 microns. The news of 0.2-micron chips is for the whole world. It’s all a shocking bullet.

The only thing that pleases the major chip makers is that the volume of Lin Wafer is not large, and currently there are only two small and medium-sized fabs in mass production. Although they are still desperately expanding production capacity, it will take time for the production capacity to land.

However, the pressure that Lin Wafer brings to the industry is not small.

Many manufacturers with backward chip manufacturing processes actively contacted Lin Wafer to seek cooperation opportunities.

LELE technology is born for the weak.

The upgrade of semiconductor technology and the investment in equipment are astronomical. Now that there is a method that does not require investment in equipment, its appeal to capitalists is not just a little bit.

The reason why intel dominates the market, and finally formed a de facto monopoly, is not that their chips are well designed, but that their chip manufacturing processes are powerful.

But now there are Lin wafers.

Everything is messed up.

In the direction of the chip manufacturing process, a new branch has appeared.

In addition to seeking cooperation, all major chip manufacturers have announced their entry into LELE technology. It is the result of collectively digging people to Lin Weifang.

As long as one or two are recruited and returned, at least one to two years can be saved.

In the semiconductor industry where investment and technology are both intensive, everyone knows how valuable a year is.

Seeing that the speed of chip manufacturing progress will be greatly surpassed by Moore’s Law under the instigation of butterfly wings, and progress by leaps and bounds.

The moment when true 3D chip technology is needed may come soon.

————————

“Oh, I regret it. I shouldn’t have studied this graduate student.”

Zheng Shanyan sighed.

“Why?”

“I met several classmates today, and they have all become technical backbones.”

Although Zheng Shanyan’s classmates are only undergraduates, because of Lin Fai’s start-up, there are many opportunities. Some capable people have emerged and become small leaders at the group leader level.

“You are developing well, you have several papers in your hand. If you want to go abroad, it should be easy.”

“Well, let me be honest, Senior Sister Wei. I heard that Lin Faiqi is preparing to raise funds and issue stocks, right?”

Most people are realistic. Going abroad is good, but wouldn’t it be better to lie down and win?

“Yes. You are well informed.”

“What’s the use of being smart? I’m in a hurry now, and I can’t get enough energy. It will take me at least two years to graduate.”

Bai Xuecheng’s team, after solving the problem of the yield rate of domestically produced lines, began intensive financing.

It’s different from Ye Jing’s research thinking. Good wine requires good publicity.

The wafer industry is a capital-intensive industry. What Lin Wafer needs to do is to immediately expand its production capacity and expand its market share.

The premise of all this is money, and it is a huge amount of money!

The wafer industry is a winner-takes-all industry, just like the later generation of TSMC. One company ate away 70% of the profits of the entire industry.

So far, Lin Wafer has only one 908 line into normal production. It is not convincing to attract investors by relying on reports.

As a result, during this period of time, Lin Weifang continued to launch various satellites outward.

Actively inviting news media to visit 3DRAM production technology is also one of the means.

This is in stark contrast to the obscurity of the previous two years.

With the deciphering of a large number of new technologies and the news of the successful development of 0.2 micron samples, Lin Huayi turned the ugly duckling into a swan in a blink of an eye.

Along with this shareholder enthusiasm, Lin Wafer announced in a high-profile manner that in addition to the 0.2 micron supported by the N+2 process, the normal 0.5 micron production line and the 0.35 micron production line are all on schedule.

Investors can directly invest in Lin Wafer, or they can invest in shares according to projects, or even acquire already built production lines, such as the former line and the current CMOS camera dedicated line.

Plenty and frugality are determined by people.

Lin Faye’s financing case was aroused and raged, attracting the eyes of investors from all over the world.

“Or, come and work with me. Your master’s degree will be transferred to a part-time study.”

Wei Xihan likes Zheng Shanyan. In the superconducting census project, Zheng Shanyan’s down-to-earth style won her favor.

Due to his special experience, in Wei Xihan’s team, women accounted for the majority. Lin Da is like this, it is still the same when it comes to Lin Pingfa.

“It’s okay too?”

“I’ll come forward to help you run.”

“Really?”

“of course.”

Although Wei Xihan is just a business manager in the R&D department, she has a lot of face. At Lin University, there is Lin Weifang, she can almost walk sideways.

————————

“Then what about us? Sister Wei, you can apply for us together.”

A group of young people eating melon next to them immediately became energetic.

With the semi-active and semi-passive publicity, Lin Weifang saw that he was about to take off.

In addition, the joining of a large number of international Chinese talents has also made people’s expectations of Lin Faye a high fever.

“I’m afraid it won’t work. Xiao Zheng is a special case. She has followed me before.”

“It’s not too late for us to talk to you now!”

A group of bookworms straightened their chests immediately, combed their hair, and swayed coolly.

See if you can use beautiful men’s tricks.

Apart from other things, there are several beautiful senior sisters who participate in the meal at this table. If you join successfully, not only will you have a successful career, but you will also have hope for leaving the singles. Rebirth of Northland Technology latest chapter address: https://www.mtlnovel.com/book/128175.htmlRebirth of Northern Science and Technology Full Text Reading Address: https://www.mtlnovel.com/read/128175/Rebirth of Northland Technology txt download address: https://www.mtlnovel.com/down/128175.htmlRebirth of Northland Technology Mobile Reading: https://m.mtlnovel.com/read/128175/For the convenience of reading next time, you can click “Favorites” below to record the reading record of this time (Chapter 641 True and False 3D Chips), next time you open the bookshelf Can be seen! If you like “Rebirth of Northland Technology”, please recommend this book to your friends (QQ, blog, WeChat, etc.), Thank you for your support! ! (www.mtlnovel.com)