Reborn multinational giant - Chapter 831

“Jiang Shangyi, former operating director of TSMC, became the vice chairman of Tongfu micro power!”

When the news spread across the mainland chip industry, the whole industry was shocked.

“It’s amazing that Tongfu micro power can dig Jiang Shangyi silently!” Wang Xinchao, chairman of Changdian technology, one of the three giants of chip sealing and testing in mainland China, admired it and felt incredible at the same time.

The strength of Changdian technology is even better than that of Tongfu micro power. However, it is difficult for them to find even the next level R & D Manager of TSMC, not to mention people at the level of Jiang Shangyi.

“I heard it was arranged by Xinsheng fund!”

“Xinsheng fund!” hearing that it was the arrangement of Xinsheng fund, Wang Xinchao’s incredible feeling disappeared.

Who is Xinsheng fund? The chip fund founded by Fang Zhe, the world’s richest man, is regarded by many Chinese as the hope of the rise of the mainland chip industry.

From bringing together SMIC and Qualcomm to sign orders, to inviting Liang Mengsong to be the CEO of SMIC, to the introduction of 14nm lithography machine and the establishment of several chip funds, SMIC has leveraged hundreds of billions of funds into the chip industry, which has benefited the whole chip industry.

In addition, Xinsheng fund has dug up hundreds of chip talents from all over the world for the domestic chip industry in recent years.

Now that Xinsheng fund can dig Jiang Shangyi, Wang Xinchao doesn’t think it’s strange. Of course!

Several domestic chip sealing and testing giants, including Changdian technology and Tianshui Huatian, are quite shocked. They believe that the arrival of Jiang Shangyi will inevitably stir the domestic chip sealing and testing industry!

In addition to the chip sealing and testing industry, many people in the chip industry are also quite puzzled. They don’t understand how Jiang Shangyi went to the chip sealing and testing company, rather than the chip manufacturing company such as SMIC international, which many people suspect.

“Jiang Shangyi should go to SMIC and go to Tongfu micro power, which is a little inferior!”

“I don’t think so. Jiang Shangyi is Liang Mengsong’s old superior. It has long been rumored in the industry that they are not at peace and that they are just separated!”

“I don’t object to their separation, but why is Jiang Shangyi going to connect Fuwei power and do chip sealing and testing?”

“Liang Mengsong, CEO of SMIC international, is from Baodao. Now Tongfu micro power has invited another Baodao person. Is there no one in China’s chip industry? Just invite Baodao people to be the master!”

“TSMC’s advancement in the chip industry is a fact. These two are top technical experts in the chip industry. If the road doesn’t even have this amount of gas, what else to talk about ty?”

For the doubts of the outside world, Jiang Shangyi made an answer at the first China core innovation annual meeting held on February 15.

China chip innovation annual conference is a chip industry event jointly organized by the chip foundation, the national Chip Fund, a number of famous chip industry companies and relevant government departments. It aims to promote exchanges in the chip industry and help the domestic chip industry develop more rapidly.

Many government leaders, chairmen or CEOs of hundreds of chip companies, several industry experts and a number of chip industry investors attended the event.

At this grand meeting, Jiang Shangyi put forward his own views on the development of domestic chip industry as vice chairman and industry expert of Tongfu micro electronics for the first time.

“I think many friends at the scene are very confused about my joining Tongfu wechat.

Many people outside asked why I joined Tongfu micro power instead of a chip manufacturing company.

Indeed, what the mainland needs most is advanced chip manufacturing technology.

However, in my personal opinion, the chip manufacturing process is important, but it does not mean that the chip packaging and testing process is not important.

As we all know, the process technology of the chip industry has been closer and closer to the limit of Moore’s law.

The 14nm chip process has matured in the world, and the 7Nm process has made a breakthrough in advanced manufacturers.

Next, whether it is 5nm, 3nm or even 1nm, it can be predicted within 5 to 10 years.

There are many debates in the industry about which direction the chip industry should develop in the future.

Some people believe that it should be solved on the basis of basic materials and find alternatives to silicon to break through the limit of Moore’s law.

Some people also believe that the existing chip architecture design should be optimized to further compress the performance of the chip.

Personally, I am optimistic about the latter.

Since the development of the chip industry in the 1960s, silicon has always been used as the basic material, and even Silicon Valley in the United States is famous all over the world.

It is difficult to find a substitute for silicon in a short time.

At present, chip packaging and circuit board technology have not changed and broken through for decades, which is one of the bottlenecks restricting the improvement of chip system performance.

Personally, I have always believed that in the post Moore era, when everyone’s chip manufacturing process is difficult to go further and the gap is gradually narrowing, the key to the success of the chip industry will be transferred from chip manufacturing to chip sealing and testing. This is also what I choose to join Tongfu micro power and will strive to promote and achieve in the next few years. ”

Jiang Shangyi’s words aroused the discussion of many chip industry experts and enterprise executives on the scene.

The chip industry is changing with each passing day. Even today’s leading companies can’t guarantee that they can still maintain a leading edge 10 or 20 years later.

Just like the earliest, Fairchild nurtured the bud of the chip industry. Then Intel dominated the world with the IDM model integrating chip design, manufacturing, packaging and testing. Later, TSMC’s OEM model led the mainstream. ASML has dominated the global lithography industry from the edge of bankruptcy for only a few decades.

Perhaps tomorrow, a chip company suddenly finds an alternative material or new process of silicon, and the pattern of the global chip industry will be reshuffled.

Therefore, many people are convinced that the key to the success of the chip industry in the post Moore era will be transferred from chip manufacturing to chip sealing and testing.

Some chip sealing and testing companies on the scene are even more pleased. Although they are not as popular as SMIC at present, they are sure that they will surpass SMIC in the future.

Less than a week after Jiang Shangyi joined Tongfu micro power, the share price of Tongfu micro power continuously pulled several limit boards, which made other mainland chip packaging and testing companies envious.

At the same time, the industry also began to spread the news that SMIC began to pilot produce 14nm chips in small quantities.

For a while, the mainland chip industry was improving, and many media exclaimed that the mainland chip industry had entered the fast lane of development.

In such a positive atmosphere of the mainland chip industry, Fang zhe visited Jianghai SMIC international headquarters again.

The reason why Fang zhelai came is very simple:

Wu Yanbin, the director of SMIC fund in SMIC international, reported to him that seeing the formal mass production of SMIC’s 14nm chip coming soon, Datang Telecom, the second largest shareholder of SMIC international, who had previously signed a gambling agreement with SMIC fund, reneged!